It can be said that multifunctional wedge bonding machine is not only an indispensable key tool in the semiconductor manufacturing process, but also a witness and promoter of scientific and technological progress.
The efficient energy conversion mechanism of the multifunctional wedge bonding machine is the key basis for achieving energy-saving welding.
In the semiconductor manufacturing process, achieving efficient bonding between chip and lead frame is one of the key steps to ensure device performance and reliability.
The protective measures of multifunctional wedge bonding machine are also reflected in the daily maintenance and care design.
As electronic devices develop towards miniaturization, lightness and high performance, the demand for high-density, fine-pitch packaging is growing.
In order to achieve high-precision position control, multifunctional gold ribbon bonding machine adopts a series of advanced technologies and precision structures.