Multifunctional gold ribbon bonding machine high-precision position control and stable bonding pressure guarantee mechanism
Publish Time: 2025-04-29
In the semiconductor production packaging process, multifunctional gold ribbon bonding machine, as a key equipment, needs to achieve high-precision position control and stable bonding pressure under different bonding requirements to ensure bonding quality and product reliability.In order to achieve high-precision position control, multifunctional gold ribbon bonding machine adopts a series of advanced technologies and precision structures. From the hardware level, the structural design of its bonding head is crucial. The bonding head is equipped with high-precision motion actuators, such as precision motors and high-resolution transmission components. These components are manufactured with extremely high precision and can achieve precise motion control at the micron level. At the same time, the equipment also uses high-precision position sensors, such as grating rulers, which can feedback the position information of the bonding head in real time and accurately. During the movement, the sensor continuously monitors the position of the bonding head and transmits the data to the control system. The control system adjusts the motion actuator in real time according to the preset bonding position requirements to form a closed-loop control system. This closed-loop control can effectively eliminate the influence of mechanical errors, thermal deformation and other factors on position accuracy, ensuring that the bonding head can accurately reach the pad position on the chip and lead frame. In addition, the equipment also has an advanced visual alignment system, which captures the images of the chip and the pad through a high-resolution camera, and uses image processing algorithms for precise positioning and alignment, further improving the accuracy of position control.In terms of ensuring stable bonding pressure, the multifunctional gold ribbon bonding machine also has an excellent design. Its bonding pressure control system uses a high-precision pressure sensor, which can sense the pressure changes during the bonding process in real time. The pressure sensor converts the detected pressure signal into an electrical signal and transmits it to the control system. The control system accurately controls the pressure adjustment mechanism according to the preset bonding pressure value. The pressure adjustment mechanism usually uses a high-precision servo motor to drive the piston and other methods to quickly and accurately adjust the bonding pressure. At the same time, the equipment also has a pressure buffer mechanism, such as soft landing technology, which effectively buffers the impact force when the bonding head initially contacts the chip through a special mechanical structure to avoid damage to the chip or pad due to excessive impact force, while ensuring that the bonding pressure can be applied smoothly and evenly to the bonding part. In addition, in order to cope with the changes in pressure under different bonding requirements, the control system also has an adaptive adjustment function. It can automatically adjust the pressure parameters according to the characteristics of the bonding material, wire diameter and other factors to ensure that the pressure remains stable throughout the bonding process.The multifunctional gold ribbon bonding machine achieves high-precision position control and stable bonding pressure under different bonding requirements through advanced hardware design, high-precision sensors and intelligent control systems. This not only improves the quality and reliability of semiconductor packaging, but also provides strong technical support for the development of the semiconductor industry.
