In the semiconductor manufacturing process, achieving efficient bonding between chip and lead frame is one of the key steps to ensure device performance and reliability.
The protective measures of multifunctional wedge bonding machine are also reflected in the daily maintenance and care design.
As electronic devices develop towards miniaturization, lightness and high performance, the demand for high-density, fine-pitch packaging is growing.
In order to achieve high-precision position control, multifunctional gold ribbon bonding machine adopts a series of advanced technologies and precision structures.
Each time after the welding process is switched, the ball welding machine needs to quickly complete calibration and inspection to ensure welding accuracy and quality.
Optimizing wedge bonding process parameters to improve the working efficiency and welding quality of multifunctional wedge bonding machine is the key to ensuring connection reliability and production efficiency in semiconductor packaging.