The multifunctional wedge bonding machine achieves precise control of bonding force through a fully closed-loop pressure control system and advanced force compensation algorithm.
The structural optimization of the multifunctional ball bonding machine design provides a physical basis for parameter adjustment.
In the precision world of the semiconductor industry, the multifunctional wedge bonding machine is like a "micrometer-level goldsmith" at the fingertips
In the delicate and complex semiconductor industry, the multifunctional gold ribbon bonding machine, with its exceptional precision, intelligent control, and powerful adaptability
Compared with single-function welding equipment, the adjustment flexibility of the multifunctional ball bonding machine is significantly superior.
It can be said that multifunctional wedge bonding machine is not only an indispensable key tool in the semiconductor manufacturing process, but also a witness and promoter of scientific and technological progress.