Against this backdrop, the ball-wedge integrated multifunctional bonding machine, with its unique "one machine, two processes" capability, has become a key piece of equipment to meet the demands of hybrid bonding processes.
The multifunctional wedge bonding machine achieves precise control of bonding force through a fully closed-loop pressure control system and advanced force compensation algorithm.
The structural optimization of the multifunctional ball bonding machine design provides a physical basis for parameter adjustment.
In the precision world of the semiconductor industry, the multifunctional wedge bonding machine is like a "micrometer-level goldsmith" at the fingertips
In the delicate and complex semiconductor industry, the multifunctional gold ribbon bonding machine, with its exceptional precision, intelligent control, and powerful adaptability
Compared with single-function welding equipment, the adjustment flexibility of the multifunctional ball bonding machine is significantly superior.