In order to achieve high-precision position control, multifunctional gold ribbon bonding machine adopts a series of advanced technologies and precision structures.
Each time after the welding process is switched, the ball welding machine needs to quickly complete calibration and inspection to ensure welding accuracy and quality.
Optimizing wedge bonding process parameters to improve the working efficiency and welding quality of multifunctional wedge bonding machine is the key to ensuring connection reliability and production efficiency in semiconductor packaging.
The ball-wedge integrated multifunctional bonding machine has adopted a variety of advanced technologies and designs to ensure the reliable performance of the solder joints during the bonding process.
As a key equipment in the semiconductor production packaging process, the convenience of operation of multifunctional gold ribbon bonding machine is crucial to improving user experience.
Welding accuracy is one of the important indicators to measure the performance of multifunctional gold ribbon bonding machine.