As the manufacturing industry increases its demand for precision and personalization, the path planning technology of such equipment will continue to evolve, becoming an indispensable core equipment in the high-end manufacturing field.
The system can record historical operation data and optimize temperature control strategies through big data analysis to further improve the stability of bonding quality.
In the precise universe of semiconductor manufacturing, transistors on a wafer are as numerous as stars, and connecting these microscopic units to the outside world are countless gold or aluminum wires as thin as a hair.
Enterprises need to provide systematic safety training for operators, covering equipment structure and principles, operating procedures, hazard identification, and emergency response measures.
The transducer is made of piezoelectric ceramic material, and its resonant frequency matches the quality of the wedge to ensure efficient transmission of ultrasonic energy.
As a multifunctional machine that integrates gold wire, aluminum wire, and gold ribbon bonding, a key element of the multifunctional gold ribbon bonding machine's performance lies in its precise and stable bond force control.