The ball-wedge integrated multifunctional bonding machine has adopted a variety of advanced technologies and designs to ensure the reliable performance of the solder joints during the bonding process.
As a key equipment in the semiconductor production packaging process, the convenience of operation of multifunctional gold ribbon bonding machine is crucial to improving user experience.
Welding accuracy is one of the important indicators to measure the performance of multifunctional gold ribbon bonding machine.
Founded in 2023, the company is a national high-tech enterprise focusing on the research and development of semiconductor packaging and testing equipment and precision automation equipment.