The multifunctional ball bonding machine integrates a temperature feedback module, which monitors the temperature of the welding area in real time through an infrared sensor and transmits the data to the control system.
As the core equipment in this process, the multifunctional gold ribbon bonding machine precisely connects the chip pads to the lead frame pads using gold or aluminum wires.
As a high-end device integrating gold/aluminum wire ball bonding and wedge bonding, the ball-wedge integrated multifunctional bonding machine must achieve highly repeatable and reliable precise connections at the micrometer or even submicrometer scale.
The multifunctional ball bonding machine integrates temperature and vibration sensors to monitor changes in the equipment's operating environment in real time.
The thinner the gold foil, the stronger the intermolecular forces per unit area, but at the same time, the higher the requirements for the flatness of the substrate surface.
The equipment must have an adaptive adjustment function, automatically correcting process parameters based on external factors such as ambient temperature and humidity to avoid temperature fluctuations caused by environmental changes.